The latest trending report Global Wafer Bonders Market by Manufacturers, Regions, Type and Application, Forecast to 2024 offered by DecisionDatabases.com is an informative study covering the market with detailed analysis. The report will assist reader with better understanding and decision making.
Wafer bonding is commonly used in Front-end of line (FEOL) operational steps as wafer-to-wafer bonding provides strength if the device wafer is to be thinned to ultra-thin dimensions. The statistic scope is wafer bonder in this report.
The worldwide market for Wafer Bonders is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2024, from xx million US$ in 2019.
This report focuses on the Wafer Bonders in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
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Market Segment by Manufacturers, this report covers
- EV Group (EVG)
- SUSS MicroTec
- Dynatex International
- Mitsubishi Heavy Industries
- Kulicke & Soffa Industries, Inc
- Ayumi Industries Company Limited
- Tokyo Electron Limited
- Tokyo Ohka Kogyo Co., Ltd
- Finetech GmbH & Co. KG
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Semi-Auto Type
- Fully Automatic Type
Market Segment by Applications, can be divided into
- Advanced Packaging (BSI CIS, CIS capping WLP, 3D stack TSV)
- LED Devices
- SOI Substrate
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The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Bonders product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Wafer Bonders, with price, sales, revenue and global market share of Wafer Bonders in 2017 and 2018.
Chapter 3, the Wafer Bonders competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Bonders breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Wafer Bonders market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Wafer Bonders sales channel, distributors, customers, research findings and conclusion, appendix and data source.
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